收藏本站
Precautions
2. Mounting precautions
(1) Things to know before mounting
a) Do not reuse the FPCAP that has already been assembled in a device and energized.
Excluding the FPCAP that has been removed for measuring electrical characteristics during a periodic inspection,
they cannot be reused.
b) Leakage current may increase if the part has been stored for a long period of time.
In this case, use after voltage treatment under the rated voltage.
(2) Mounting-1
a) Mount after checking the capacitance and the rated voltage.
b) Mount after checking the polarity.
c) Do not drop on the floor and do not use parts that have been dropped.
d) Do not deform and then mount.
(3) Mounting-2
a) Mount after checking the match between the lead pitch and the PC board holes pitch.
b) When an automatic insertion equipment is used to clinch the lead wires, make sure it is set correctly.
c) Be careful of the shock force that can be produced by the automatic insertion equipment.
d) Do not apply excessive external force to the lead wires, the FPCAP itself, or the electrode terminals.
(4) Soldering with a soldering iron
a) Set the soldering conditions (temperature, time) so that they fall within the range stipulated by the catalog specification.
b) When the lead wire terminal must be processed because the terminal spacing and the PC board holes spacing do not match,
process it before soldering so that no stress is applied to the FPCAP itself.
c) Do not subject the FPCAP itself to excessive stress when soldering with a soldering iron.
d) When a soldering iron is used to repair the FPCAP that has already been soldered once and needs to be removed,
do it after the solder has been completely melted so that no stress is applied to the FPCAP terminals.
e) Do not let the tip of the soldering iron touch the FPCAP itself.
f ) The amount of leakage current after soldering may increase a slightly (from a few μ A to several hundred μ A) depending
on the soldering condition (preheating and solder temperature and time, PC board material and thickness, etc.)
The leakage current can be reduced by applying voltage.
(5) Flow soldering (Radial lead type)
a) Never submerge the FPCAP in molten solder. Use the PC board to protect the FPCAP and only solder the opposite side
of the board that the FPCAP is mounted on.
b) Set the soldering conditions (soldering temperature, terminal submersion time) so that they fall within the range stipulated
by the catalog specification. The amount of leakage current after soldering may increase slightly (from a few μ A to several
hundred μ A) depending on the soldering conditions (preheating and solder temperature and time, PC board material and
thickness, etc.). The leakage current can be reduced through self-repair by applying voltage.
c) Take care that flux does not adhere to any place other than the terminals.
d) When soldering, take care that other components do not fall over and touch the FPCAP.
e) Flow soldering under extremely abnormal conditions may reduce the capacitance of products before or after soldering.
(6) Reflow soldering (SMD type)
Do not use reflow soldering for Radial lead type (Through Hole).
a) Never submerge the FPCAP in molten solder. Use the PC board to protect the FPCAP and only solder the opposite side
of the board that the FPCAP is mounted on.
b) Set the soldering conditions (soldering temperature, terminal submersion time) so that they fall within the range stipulated
by the catalog specification. The amount of leakage current after soldering may increase slightly (from a few μ A to several
hundred μ A) depending on the soldering conditions (preheating and solder temperature and time, PC board material and
thickness, etc.). The leakage current can be reduced through self-repair by applying voltage.
c) Take care that flux does not adhere to any place other than the terminals.
d) When soldering, take care that other components do not fall over and touch the FPCAP .
e) Reflow soldering under extremely abnormal conditions may reduce the capacitance of products before or after soldering.
f) Do not use VPS (Vapor Phase Soldering).
NICHICON CORPORATION / FPCAP ELECTRONICS (SUZHOU) CO., LTD.
3
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
RS80G561MDNASQJT CAP ALUM 560UF 4V 20% RADIAL
RSL0E331MCN1GB CAP ALUM 330UF 2.5V 20% SMD
RSL1E150MCN1GB CAP ALUM 15UF 25V 20% SMD
RSO-4812DZ/H3 CONV DC/DC 1W DL +/-12V OUT SIP8
RSS1C101MCN1GS CAP ALUM 100UF 16V 20% SMD
RSZ-3.33.3/P-R CONV DC/DC 1W 3.3VIN 3.3VOUT
RTS-243.3-R CONV DC/DC 2W 24VIN 3.3VOUT
RU-3.30505/HP CONV DC/DC 1W 3.3VIN 0505VOUT
相关代理商/技术参数
RS80E331MDN1 功能描述:铝有机聚合物电容器 2.5 Volt 330uF 20% RoHS:否 制造商:Panasonic Electronic Components 电容:470 uF 容差:20 % 电压额定值:2.5 V ESR:4.5 mOhms 工作温度范围:- 40 C to + 105 C 端接类型:SMD/SMT 外壳直径: 外壳长度:7.3 mm 外壳宽度:4.3 mm 外壳高度:1.9 mm 封装:Reel
RS80E331MDN1JT 功能描述:CAP ALUM 330UF 2.5V 20% RADIAL RoHS:是 类别:电容器 >> 铝 系列:S8 标准包装:2,000 系列:142 RHS 电容:4700µF 额定电压:10V 容差:±20% 寿命@温度:105°C 时为 2000 小时 工作温度:-40°C ~ 105°C 特点:通用 纹波电流:1.26A ESR（等效串联电阻）:- 阻抗:- 安装类型:通孔 封装/外壳:径向，Can 尺寸/尺寸:0.492" 直径（12.50mm） 高度 - 座高（最大）:1.063"（27.00mm） 引线间隔:0.197"（5.00mm） 表面贴装占地面积:- 包装:散装
RS80E331MDN1PX 功能描述:铝有机聚合物电容器 RoHS:否 制造商:Panasonic Electronic Components 电容:470 uF 容差:20 % 电压额定值:2.5 V ESR:4.5 mOhms 工作温度范围:- 40 C to + 105 C 端接类型:SMD/SMT 外壳直径: 外壳长度:7.3 mm 外壳宽度:4.3 mm 外壳高度:1.9 mm 封装:Reel
RS80E331MDNASQ 功能描述:铝有机聚合物电容器 2.5 Volt 330uF 20% RoHS:否 制造商:Panasonic Electronic Components 电容:470 uF 容差:20 % 电压额定值:2.5 V ESR:4.5 mOhms 工作温度范围:- 40 C to + 105 C 端接类型:SMD/SMT 外壳直径: 外壳长度:7.3 mm 外壳宽度:4.3 mm 外壳高度:1.9 mm 封装:Reel
RS80E331MDNASQJT 功能描述:CAP ALUM 330UF 2.5V 20% RADIAL RoHS:是 类别:电容器 >> 铝 系列:S8 标准包装:2,000 系列:142 RHS 电容:4700µF 额定电压:10V 容差:±20% 寿命@温度:105°C 时为 2000 小时 工作温度:-40°C ~ 105°C 特点:通用 纹波电流:1.26A ESR（等效串联电阻）:- 阻抗:- 安装类型:通孔 封装/外壳:径向，Can 尺寸/尺寸:0.492" 直径（12.50mm） 高度 - 座高（最大）:1.063"（27.00mm） 引线间隔:0.197"（5.00mm） 表面贴装占地面积:- 包装:散装
RS80E471MDN1 功能描述:铝有机聚合物电容器 2.5 Volt 470uF 20% RoHS:否 制造商:Panasonic Electronic Components 电容:470 uF 容差:20 % 电压额定值:2.5 V ESR:4.5 mOhms 工作温度范围:- 40 C to + 105 C 端接类型:SMD/SMT 外壳直径: 外壳长度:7.3 mm 外壳宽度:4.3 mm 外壳高度:1.9 mm 封装:Reel
RS80E471MDN1JT 功能描述:CAP ALUM 470UF 2.5V 20% RADIAL RoHS:是 类别:电容器 >> 铝 系列:S8 标准包装:2,000 系列:142 RHS 电容:4700µF 额定电压:10V 容差:±20% 寿命@温度:105°C 时为 2000 小时 工作温度:-40°C ~ 105°C 特点:通用 纹波电流:1.26A ESR（等效串联电阻）:- 阻抗:- 安装类型:通孔 封装/外壳:径向，Can 尺寸/尺寸:0.492" 直径（12.50mm） 高度 - 座高（最大）:1.063"（27.00mm） 引线间隔:0.197"（5.00mm） 表面贴装占地面积:- 包装:散装
RS80E471MDN1PX 功能描述:铝有机聚合物电容器 RoHS:否 制造商:Panasonic Electronic Components 电容:470 uF 容差:20 % 电压额定值:2.5 V ESR:4.5 mOhms 工作温度范围:- 40 C to + 105 C 端接类型:SMD/SMT 外壳直径: 外壳长度:7.3 mm 外壳宽度:4.3 mm 外壳高度:1.9 mm 封装:Reel